Thermal Testing Ash Content Crystallization Point Cure Temperature Curing Kinetics Decomposition Temperature Deflection Under Flexural Load Degree of Cure Dilatometry Dropping Point Eutectic Temperature Gel Time Glass Transition Temperature Heat Capacity Heat Distortion Heat of Fusion Lead-free (Pb-free) testing Material Characterization Melting Point Outgassing (ASTM E 595) Phase Transition Temperature Reaction Kinetics Rubber Analysis Slip Point of Fats Softening Point Solidification Point Specific Heat Thermal Conductivity Vicat Softening Temperature CTE (Coefficient of Thermal Expansion) CTE of Surface Layer by Strain Gauge Method DSC (Differential Scanning Calorimetry) DMA (Dynamic Mechanical Analysis) TGA (Thermogravimetric Analysis) TMA (Thermo Mechanical Analysis) A view of multiple testing stations for use in conducting Thermal Analysis on various materials. This is one of several areas assigned to various thermal tests. Differential Scanning Calorimetry (DSC) is used to determine specific heat, thermal effect, purity, polymorphism, glass transistion, oxidative stability, chemical reactions, reaction kinetics, melting behavior, and crystallization. Thermogravimetric Analysis (TGA) techniques are used to determine filler content, and to determine the temperature and course of decomposition as they relate to weight loss at elevated temperatures. Thermomechanical Analysis (TMA) determines the softening bahavior of polymers, the coefficient of linear expansion (CTE), glass transition temperature (Tg), shrinkage behavior, and changes in dimension caused by chemical reactions. Dynamic Mechanical Analysis (DMA) allows the determination of storage modulus E' (purely elastic component) and loss modulus E" (purely viscous component) as a function of temperature. With the aid of the damping curve, poorly-defined glass transition temperatures (which are virtually invisible with DSC or TMA) can be read (damping maximum).