SERVICES Component Screening Failure Analysis A partial list of our state-of-the-art test equipment, applicable to these testing disciplines, will include the following: Three Scanning Electron Microscopes with EDS (SEM/EDS) One Scanning Laser Acoustic Microscope (SLAM) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Three Real-Time Fluoroscopic X-ray Systems, including Two Microfocus Systems One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm) This equipment, combined with the more than 100 years of industry related experience of our staff, enables us to provide our customers the highest level of accuracy, coupled with reliable results, for problem resolution. From a simple qualitative analysis to a complex study program, we stand ready to respond to your requirements. Typical testing programs will include the following: Destructive/Non-Destructive Bond Strength Gold Wire Bond and Pull Strength Mechanical Shock Metallograph Microelectronic Failure Analysis Optical Microscopy Particle Impact Noise Detection (PIND) Shock Solderability (Meniscus) Solderability (Weight) Solderability (Edge Dip, Rotary Dip, Float) Steam Aging Vibration (Sine, Random, and Sine with Random) X-ray Radiographic Gold Wire Bond Test Area We are able to offer a wide range of Destructive and Non-destructive services on your bond-strength testing requirements. With our Ultrasonic Wedge Bonder, and our precision Micropull Wire Bond Pull Tester, we are able to provide wire bond tests in the range of 0.9 to 100 gm, in accordance with MIL-STD-883 and MIL-STD-1772. All test functions are keyboard controlled. Data generated by this equipment is logged directly onto a system printer for evaluation. Scanning Laser Acoustic Microscope This equipment may be used to provide non-destructive analysis of components in such areas as delamination, cracks, voids, etc.; in addition, it can provide information on the attenuation of materials at frequencies of 10, 30, and 100 MHz. The measurement is based on the transmission of acoustic waves through a medium, (typically water), while the surface of the component under testing is continuously scanned by a laser. One of three Vibration Test Stations With three in-house Vibration Systems, we are able to provide sine, random, and sine with random testing, on various sized components and circuit boards, both loaded and unloaded. We have many years of experience in both the design and manufacture of test fixtures, which are a critical part of all vibration testing. One of our Test Technicians preparing our Impulse Shock Test System With our Impulse Shock Test System, we are able to conduct shock tests on components and circuit boards, both loaded and unloaded. We can peform half-sine, sawtooth, and square-wave impulse testing in accordance with MIL-STD-202, MIL-STD-810, and MIL-STD-750 on specimens up to 150 pounds.